简介：
博士，教授，博士生导师，入选江西省井冈学者及主要学科学术和技术带头人（青年），江西省杰出青年基金获得者，兼任江西钨业控股集团有限公司外部董事。国际SCI期刊《Metals》编委，《中国有色金属学报》（中、英文版）、《焊接学报》及《有色金属科学与工程》等期刊青年编委。取得西北工业大学材料加工工程博士学位，美国西北大学机械工程系访问学者。长期从事电子器件封装互连、相变储热材料制备及其热管理的研究。主持国家自然科学基金4项。以第一作者（或通讯作者）发表学术论文120余篇，SCI收录100余篇，他引2000余次，授权国家发明专利6项。
近年来主持的项目：
1. 复合助焊剂与声场协同作用下锡焊点连接机理及剪切性能研究，国家自然科学基金，2024-01-01 至 2027-12-31
2. 温度梯度诱导锡焊点界面化合物定向生长及其剪切性能研究，国家自然科学基金，2022-01-01 至 2025-12-31
3. 非均质双相基板锡焊点非均匀反应性润湿机制及其可靠性研究，国家自然科学基金，2018-01-01 至 2021-12-31
4. Ni-W-P/Cu双镀层无铅焊点界面微结构及其剪切失效行为，国家自然科学基金，2015-01-01 至 2018-12-31
代表性论文：
(1) Yan Ma, Minming Zou, Wenjing Chen, Wenxing Luo, Xiaowu Hu*, et al. A structured phase change material integrated by MXene/AgNWs modified dual-network and polyethylene glycol for energy storage and thermal management. Applied Energy, 2023, 349: 121658.
(2) Wenxing Luo, MinMing Zou, Lixiang Luo, Wenjing Chen, Xiaowu Hu*, et al. Lipophilic modified hierarchical multiporous rGO aerogel-based organic phase change materials for effective thermal energy storage. ACS Applied Materials & Interfaces, 2022, 14(49): 55098-55108.
(3) Jiayin Li, Xiaowu Hu*, et al. Enhanced thermal performance of phase-change materials supported by mesoporous silica modified with polydopamine/nano-metal particles for thermal energy storage. Renewable Energy, 2021, 178: 118-127.
(4) Lixiang Luo, Wenxing Luo, Wenjing Chen, Xiaowu Hu*, et al. Form-stable phase change materials based on graphene-doped PVA aerogel achieving effective solar energy photothermal conversion and storage. Solar Energy, 2023, 255: 146-156.
(5) Xiaoyang Bi, Xiaowu Hu*, Qinglin Li. Effect of Co addition into Ni film on shear strength of solder/Ni/Cu system: experimental and theoretical investigations. Materials Science and Engineering: A, 2020, 788: 139589.
(6) Jiatao Zhou, Xiaowu Hu*, Jialing Li. Effect of Cu on the diffusion behavior and electrical properties of Ni-Co conversion coating for metallic interconnects in solid oxide fuel cells. Journal of Alloys and Compounds, 2021, 887: 161358.
(7) Jinxuan Cheng, Xiaowu Hu*, Qinglin Li. Effects of the Ni electrodeposit on microstructure evolution and electrical resistance of the P-type Bi2Te3 solder joint. Journal of Alloys and Compounds, 2020, 832: 155006.
(8) Bin Chen, Xiaowu Hu*, et al. Influence of Fe and Ho additions on Sn-3.0 Ag-0.5 Cu solder alloy: Microstructure, electrochemical and mechanical properties. Materials Characterization, 2023, 205: 113307.
(9) Zezong Zhang, Xiaowu Hu*, et al. Study of microstructure, growth orientations and shear performance of Cu/Sn-3.0 Ag-0.5 Cu/Cu solder joints by using thermal gradient bonding. Materials Characterization, 2023, 203: 113133.
(10) Bin Chen, Minming Zou, Wenjing Chen, Xiaowu Hu*, et al. Influence of CrFeCoNiCu high-entropy alloy and ultrasonic stirring on the thermal, electrochemical and mechanical properties of Zn-30Sn high-temperature solder alloy. Materials Characterization, 2023, 201:112977.
(11) Jiatao Zhou, Wenjing Chen, Jue Wang, Xiaowu Hu*, et al. Microstructure and diffusion behavior of Co-Ni-W conversion coating for metallic interconnect of solid oxide fuel cell. Materials Characterization, 2022, 194: 112378.
(12) Haozhong Wang, Xiaowu Hu*, Xiongxin Jiang. Effects of Ni modified MWCNTs on the microstructural evolution and shear strength of Sn-3.0 Ag-0.5 Cu composite solder joints. Materials Characterization, 2020, 163: 110287.
联系方式：
电话：18170021675
E-mail: huxiaowu@ncu.edu.cn